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Award Abstract #0093815
PECASE: Novel Approaches for Integration of Vertical Si Nanoelectronics


NSF Org: ECCS
Division of Electrical, Communications and Cyber Systems
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Initial Amendment Date: February 2, 2001
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Latest Amendment Date: February 9, 2007
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Award Number: 0093815
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Award Instrument: Standard Grant
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Program Manager: Rajinder P. Khosla
ECCS Division of Electrical, Communications and Cyber Systems
ENG Directorate for Engineering
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Start Date: February 1, 2001
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Expires: January 31, 2008 (Estimated)
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Awarded Amount to Date: $400000
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Investigator(s): Veena Misra vmisra@ncsu.edu (Principal Investigator)
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Sponsor: North Carolina State University
CAMPUS BOX 7514
RALEIGH, NC 27695 919/515-2444
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NSF Program(s): ELECT, PHOTONICS, & DEVICE TEC
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Field Application(s): 0206000 Telecommunications
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Program Reference Code(s): OTHR, 1187, 1045, 0000
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Program Element Code(s): 1517

ABSTRACT



PECASE: Novel Approaches for Integration of Vertical Si Nanoelectronics

Veena Misra

This proposal will investigate novel approaches in the integration of high-K dielectrics and metal gates with vertical CMOS devices. This integration offers low temperature compatibility since high-K gatestack formation in vertical devices can be performed after the source/drain regions are defined, thus avoiding any high temperature exposure. This offers tremendous opportunity for achieving ultimate CMOS performance. Within the integration scheme, several novel approaches will be evaluated. Thin layers of metals placed on grown SiO2 layers will be used to convert SiO2 to a high-K layer. Chemical vapor deposition of low metal content SiO2 layers will be evaluated for their high dielectric constant, low leakage current, and excellent mobility. Metal gates will be integrated using CVD processing and workfunction modulation will also be explored. The integration knowledge obtained will be evaluated on a novel self-assembled device in which both channel length and channel thickness are lithography independent. In the education plan, several initiatives will be pursued such as: a) organization of a workshop on integration challenges of vertical devices, b) development of a new course (classroom and web-based) in EE at NCSU entitled "Beyond Bulk CMOS", c) development of a 30-min video tape on nano-chip technology, and d) development of a "nano-chip kit" that will include a microscope, Si wafer, discrete MOSFET, an integrated circuit chip, human hair and cross-sectional scanning and transmission electron micrographs of nanoscale feaures. The goal here is to excite young students (K-12) about nanotechnology by providing them with an early exposure to this fast growing field.


PUBLICATIONS PRODUCED AS A RESULT OF THIS RESEARCH

Lee, B; Biswas, N; Novak, SR; Misra, V. "Characteristics of Ni/Gd FUSI for NMOS gate electrode applications," IEEE ELECTRON DEVICE LETTERS, v.28, 2007, p. 555-557. 

 

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Last Updated:
April 2, 2007
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Last Updated:April 2, 2007