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Fabricating Thin Film Wiring
A researcher at the Georgia Institute of Technology's Center for Low Cost Electronics Packaging (PRC) is fabricating thin film wiring on a low, CTE-based substrate using an Anvik" Hexscan. Research at the center will lead to new substrate materials and will allow researchers to explore new processes in analytical modeling and characterization.
This work is funded by the National Science Foundation's Engineering Research Centers program, the electronics industry and the state of Georgia. For more information, visit the Georgia Tech Center for Low Cost Packaging Research website, Here.
Credit: Courtesy Georgia Tech's Center for Low Cost Electronics Packaging Research; photo by Stanley F. Leary
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