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Size of device pad structure compared to penny


A device pad structure is shown next to a penny for comparative size

A device pad structure is shown next to a penny for comparative size. The Georgia Institute of Technology's Center for Low Cost Packaging Research (PRC) envisions future devices such as ICs, micro electro-mechanical systems (MEMS) and integral passives will be embedded in the substrate via system-on-package enabling technologies. Research at PRC is funded by the National Science Foundation Engineering Research Centers Program, the electronics industry and the state of Georgia.

For more information, visit the PRC website Here.

Credit: Courtesy Georgia Tech Center for Low Cost Electronics Packaging Research; photo by Stanley F. Leary

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