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Low-resistance Connections Facilitate Multi-walled Carbon Nanotubes for Interconnects


October 30, 2012

a silicon substrate with an array of electrodes Using a new method for precisely controlling the deposition of carbon, researchers have demonstrated a technique for connecting multi-walled carbon nanotubes to the metallic pads of integrated circuits without the high interface resistance produced by traditional fabrication techniques. Full Story

Source
Georgia Institute of Technology Research News

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