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UT-Arlington Engineers Working to Prevent Heat Buildup Within 3-D Integrated Circuits


December 19, 2012

engineering graphic In the effort to pile more power atop silicon chips, engineers at the University of Texas at Arlington have developed the equivalent of mini-skyscrapers in 3-D integrated circuits and encountered a new challenge: How to manage the heat created within the tiny devices. Full Story

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University of Texas at Arlington

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