Survey Materials

The mailout of the R&D Expenditures Survey packets is typically completed in late October. Included in each mailout packet are the following:

Cover letter addressed to the respondent;
"FYI" flyer describing the NSF academic survey system;
Two sets of the current year survey questionnaire with instructions and NSF/NCES crosswalk that defines S&E fields;
Facsimile containing the institution's previous three years of data;
Question and Answer booklet;
Survey acknowledgment postcard; and
Any optional survey items, with instructions.

FY 1995 and 1996 Questionnaire and Other Mailout Materials