This program has been archived.
Communications, Circuits, and Sensing-Systems (CCSS)
|Mona Zaghloulemail@example.com||(703) 292-8339||525 N|
|Hao Lingfirstname.lastname@example.org||(703) 292-8339||525 N|
|Chengshan Xiao||CXIAO@nsf.gov||(703) 292-8339||525 N|
|George Haddademail@example.com||(703) 292-8339||525 N|
|Zhi Tianfirstname.lastname@example.org||(703) 292-8339||525 N|
Important Information for Proposers
ATTENTION: Proposers using the Collaborators and Other Affiliations template for more than 10 senior project personnel will encounter proposal print preview issues. Please see the Collaborators and Other Affiliations Information website for updated guidance.
A revised version of the NSF Proposal & Award Policies & Procedures Guide (PAPPG) (NSF 18-1), is effective for proposals submitted, or due, on or after January 29, 2018. Please be advised that, depending on the specified due date, the guidelines contained in NSF 18-1 may apply to proposals submitted in response to this funding opportunity.
The Communications, Circuits, and Sensing-Systems (CCSS) Program is intended to spur visionary systems-oriented activities in collaborative, multidisciplinary, and integrative research. CCSS supports systems research in hardware, signal processing techniques, and architectures to enable the next generation of cyber-physical systems (CPS) that leverage computation, communication, and algorithms integrated with physical domains. CCSS supports innovative research and integrated educational activities in micro- and nano- electromechanical systems (MEMS/NEMS), communications and sensing systems, and cyber-physical systems. The goal is to design, develop, and implement new complex and hybrid systems at all scales, including nano and macro, that lead to innovative engineering principles and solutions for a variety of application domains including, but not limited to, healthcare, medicine, environmental monitoring, communications, disaster mitigation, homeland security, transportation, manufacturing, energy, and smart buildings. CCSS also supports integration technologies at both intra- and inter- chip levels, new and advanced radio frequency (RF), millimeter wave and optical wireless and hybrid communications systems architectures, and sensing and imaging at terahertz (THz) frequencies.
Proposals for the CCSS program may involve collaborative research to capture the breadth of expertise needed for such multidisciplinary integrative activities. ECCS will consider supporting a limited number of small team proposals of three or more Investigators from different disciplines and/or universities.
Areas of interest include:
- Low Power, Low Noise, High Efficiency Communications
- Inter- and Intra-Chip Communications and Networking including THz and optical guided and wireless interconnects
- Wireless Communications and Sensing circuits and systems
Integrated Circuit Design ( Mixed-Signal, Fault-Tolerant, Self -Test and Repair, Stochastic Design)
Real-Time Monitoring and Stimulation of the Brain and other Body functions in natural environments
Zhi (Gerry) Tian
RF/Wireless, Optical, and Hybrid Communications and Networking
- Integrated Sensing, Communication, and Computational Systems
- Spectrum Access and Spectrum Sharing, Cognitive Radio
- Signal Processing and Compressive Sampling
- Cyber Physical Systems and Security
- Micro, Nano, and Bio Systems (MEMS/NEMS)
- Chemical, Biological, and Physical Diagnostics
- Sensors, Actuators, and Electronic Interfaces (Brain and other Body functions, Health, Infrastructure and Environment)
- Ultra-Low power wearable and implantable sensing and imaging systems