Next-generation computer chips
NSF-funded materials research could deliver more energy-efficient electronic devices at lower prices.
Packing more features onto computer chips with NSF-funded materials research.
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August 1, 2018
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To keep pace with demands for more power, better efficiency and lower costs, computer chip manufacturers developed a new fabrication method -- extreme ultraviolet lithography -- a promising technique to create new feature-packed chips. But producing those chips requires a new chip template.
Responding to this need, Inpria, a small company founded on NSF-funded materials research, has pioneered a tin oxide template that produces features so fine that using it rather than previous templates is like changing from a fat marker to a fine-point pen to print chip features. In 2016, Chemical & Engineering News named Inpria one of "10 startups to watch." The company has secured $23.5 million in financing from leading players across the semiconductor manufacturing ecosystem.
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