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July 16, 2014
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The Micro-LAM system cuts silicon and facilitates other cutting, dicing and scoring operations.
The Micro-LAM system cutting Silicon. In addition to a turning process, the current version also facilitates cuttting, dicing and scoring operations.
Credit: Deepak Ravindra, Micro-LAM Technologies LLC
Images credited to the National Science Foundation, a federal agency, are in the public domain. The images were created by employees of the United States Government as part of their official duties or prepared by contractors as "works for hire" for NSF. You may freely use NSF-credited images and, at your discretion, credit NSF with a "Courtesy: National Science Foundation" notation.
Additional information about general usage can be found in Conditions.
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