News From the Field

A nanoscale solution to the big problem of overheating in microelectronic devices


February 3, 2015

This material is available primarily for archival purposes. Telephone numbers or other contact information may be out of date; please see current contact information at media contacts.

Currently, microelectronic device manufacturers must rely on simulations alone to understand the temperatures inside individual devices. But now, a team of University of Southern California and University of California, Los Angeles, researchers has developed a way to determine actual temperatures within these devices by using material within them as its own thermometer.Full Story

Source
University of Southern California

The U.S. National Science Foundation propels the nation forward by advancing fundamental research in all fields of science and engineering. NSF supports research and people by providing facilities, instruments and funding to support their ingenuity and sustain the U.S. as a global leader in research and innovation. With a fiscal year 2023 budget of $9.5 billion, NSF funds reach all 50 states through grants to nearly 2,000 colleges, universities and institutions. Each year, NSF receives more than 40,000 competitive proposals and makes about 11,000 new awards. Those awards include support for cooperative research with industry, Arctic and Antarctic research and operations, and U.S. participation in international scientific efforts.

mail icon Get News Updates by Email 

Connect with us online
NSF website: nsf.gov
NSF News: nsf.gov/news
For News Media: nsf.gov/news/newsroom
Statistics: nsf.gov/statistics/
Awards database: nsf.gov/awardsearch/

Follow us on social
Twitter: twitter.com/NSF
Facebook: facebook.com/US.NSF
Instagram: instagram.com/nsfgov