July 18, 2018

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Working to address "hotspots" in computer chips that degrade their performance, University of California, Los Angeles (UCLA), engineers have developed a new semiconductor material, defect-free boron arsenide, that is more effective at drawing and dissipating waste heat than any other known semiconductor or metal materials. Credit: Hu Research Lab/UCLA Samueli Full Story

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University of California, Los Angeles Samueli School of Engineering

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