Center for Advanced Vehicle Electronics (CAVE)
Research for cost-effective electronics manufacturing and packaging technologies for high-reliability electronics in a harsh environment
Center Mission and
Because the field of electronics manufacturing is multidisciplinary, collaboration between engineering disciplines and the physical sciences is essential. Faculty and scientific staff from two colleges and four departments contribute to the research efforts at Auburn University. The Center's researchers currently include more than eight faculty members and professional and scientific staff, as well as ten graduate and six undergraduate students. Within Auburn University, Transportation and Information Technology have been identified as priority program areas. The research activities within CAVE provide a bridge between these two important priority programs.
In addition to participating in the Industry/University Cooperative Research Centers Program, CAVE is active in other major research programs, including:
These laboratories provide complete facilities for the design, manufacture, environmental testing, characterization, and failure analysis of electronic assemblies. The laboratories also support materials and process equipment characterization, as well as manufacturing process development. The Laboratory for Electronics Assembly and Packaging has an automated SMT/flip-chip assembly line, as well as automated wire bonding equipment for test vehicle assembly and prototype fabrication.
Assembly Equipment: MPM AP stencil printer, Siemens Siplace 80 F5 pick and place, Heller Series 1800 reflow oven, Cam/Alot 3700 dispense system, AirVac DRS24 rework station, Yield Engineering YES R3 plasma etch system, Palomar Products Model 2460-V automatic thermosonic wire bonder, Orthodyne 360B automatic large diameter wire bonder, Karl Suss 150 precision flip-chip bonder/aligner.
Characterization and Environmental Test Equipment: Multicore MUST II solderability tester, Tencor surface profilometer, Brookfield viscometer, Dage PC2400 with load cartridges for wire pull, ball shear and die shear, Compix PC2100 thermal imaging system with magnifying lens, Buehler cutting saw and polishing system for cross-sections, Nikon measuring microscope (to 1000x) with digital imaging, Cambridge Stereoscan 90 scanning electron microscope with EDX, Sonix acoustic microscope, Phoenix micro-focus x-ray, Wisdom Technologies micro tensile-torsion thermo-mechanical test system, Blue-M burn-in ovens, Blue-M thermal cycle (air) chambers, Blue-M thermal shock (liquid) chamber, Blue-M humidity chamber, Express Test HAST-6000 chamber, Keithley Instruments 7002 switch boxes and 2001 multimeters, and Pentium-based personal computers with GPIB and LabView software.
Materials Analysis Equipment: Auger electron spectroscopy (AES,2), X-ray photoelectron spectroscopy (XPS,2), Rutherford backscattering spectroscopy (RBS), scanning electron microscopy (SEM,3), SEM/energy-dispersive x-ray spectroscopy (EDX,2), Nomarski and stereo light microscopy; ion scattering spectroscopy (ISS), scanning kinetic spectroscopy (SKS), mass spectroscopy (QMS,2), temperature programmed desorption (TPD); and a full range of capabilities for failure analysis.
Unique Solder Materials Facilities: wetting balance; video recording and heating capabilities on SEM/EDX to enable in-situ, real-time observation of solder wetting characteristics; variable-pressure, bell-jar wetting system allows study of process gas variations on solder wetting; high-pressure, UHV-compatible wetting chamber attached to surface analysis system allows for surface analysis during solder wetting and spreading; torsion oscillating viscosity system enables measurement of solder viscosity; oscillating sessile drop method measures solder surface tension.
Center Director: Dr. R. Wayne Johnson
Center Evaluator: Dr. Ralph Zee
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