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Engineering Sciences for Modeling and Simulation-Based Life-Cycle Engineering and Manufacturing
This program has been archived.
CONTACTS
PROGRAM GUIDELINES
Solicitation
05-616
Important Notice to Proposers
A revised version of the NSF Proposal & Award Policies & Procedures Guide (PAPPG), NSF 13-1, was issued on October 4, 2012 and is effective for proposals submitted, or due, on or after January 14, 2013. Please be advised that, depending on the specified due date, the guidelines contained in NSF 13-1 may apply to proposals submitted in response to this funding opportunity.
Please be aware that significant changes have been made to the PAPPG to implement revised merit review criteria based on the National Science Board (NSB) report, National Science Foundation's Merit Review Criteria: Review and Revisions. While the two merit review criteria remain unchanged (Intellectual Merit and Broader Impacts), guidance has been provided to clarify and improve the function of the criteria. Changes will affect the project summary and project description sections of proposals. Annual and final reports also will be affected.
A by-chapter summary of this and other significant changes is provided at the beginning of both the Grant Proposal Guide and the Award & Administration Guide.
DUE DATES
Archived
SYNOPSIS
This is a continuation of a collaborative research program between the National Science Foundation (NSF) and Sandia National Laboratories (Sandia) that was started in 1997. The objective of this collaborative program is to fund research projects focused on science-based experimental, computational and theoretical capabilities that enhance our understanding and confidence of the behavior of engineered systems at unprecedented multiple spatial and temporal scales.
Focus areas for this solicitation are 1) thermal transport and fluid mechanics; 2) solid mechanics and structural dynamics; 3) micro/nanoscale phenomenology and metrology; 4) predictive modeling for manufacturing and process optimization; and 5) micro/nanomanufacturing technologies
THIS PROGRAM IS PART OF
Other activities supported by CMMI
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