December 19, 2012

This material is available primarily for archival purposes. Telephone numbers or other contact information may be out of date; please see current contact information at media contacts.

In the effort to pile more power atop silicon chips, engineers at the University of Texas at Arlington have developed the equivalent of mini-skyscrapers in 3-D integrated circuits and encountered a new challenge: How to manage the heat created within the tiny devices.Full Story

Source
University of Texas at Arlington

The U.S. National Science Foundation propels the nation forward by advancing fundamental research in all fields of science and engineering. NSF supports research and people by providing facilities, instruments and funding to support their ingenuity and sustain the U.S. as a global leader in research and innovation. With a fiscal year 2023 budget of $9.5 billion, NSF funds reach all 50 states through grants to nearly 2,000 colleges, universities and institutions. Each year, NSF receives more than 40,000 competitive proposals and makes about 11,000 new awards. Those awards include support for cooperative research with industry, Arctic and Antarctic research and operations, and U.S. participation in international scientific efforts.

 Get News Updates by Email 

Connect with us online
NSF website: nsf.gov
NSF News: nsf.gov/news
For News Media: nsf.gov/news/newsroom
Statistics: nsf.gov/statistics/
Awards database: nsf.gov/awardsearch/

Follow us on social
Twitter: twitter.com/NSF
Facebook: facebook.com/US.NSF
Instagram: instagram.com/nsfgov